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1. Specifications
1) BHB Series
Imported Glass Fiber Reinforced Epoxy as backing material, the BHB series offer excellent creep and zero return
performance. With low hydroscopicity (lower than 0.5%), excellent heat-resistance (stability is lower than 45PPM) and
high response speed, BHB series are suitable for Class C3 and higher accuracy load cells manufacturing.
Key Specifications:
| Backing Thickness(um) |
32±5 |
Sealing Layer Thickness(um) |
20±2 |
| Backing Material |
Glass Fiber Reinforced Epoxy |
Grid Material |
Konstantan Foil |
| Resistance(Ω) |
120，350，1000 |
Resistance Tolerance (%) |
≤±0.15 |
| Gage Factor |
2.00～2.20 |
Dispersion of Gage Factor(%) |
≤±1 |
| Temp. Range(℃) |
-30～+80 |
STC Code |
9，11，16，23，27 |
| STC Precision(um/m/℃) |
0.5 |
Insulation Resistance(MΩ) |
10000 |
| Strain Limit |
2.0％ |
Fatigue Life(±1000 ） |
10000000 |
2) BAM Series
Special polyimide film backing, the BAM series offer better creep and back to zero function. With thin backing film, good heat resistance (stability is lower than 35PPM), low hydroscopicity（lower than 0.6%）, excellent performance and easy bonding, BAM series are suitable for Class C3 and higher accuracy load cells manufacturing.
Key Specifications:
| Backing Thickness(um) |
30±1 |
Sealing Layer Thickness(um) |
30±1 |
| Backing Material |
Polyimide Film |
Grid Material |
Konstantan Foil |
| Resistance(Ω) |
350，650，1000 |
Resistance Tolerance(%) |
≤±0.1 |
| Gage Factor |
2.00～2.20 |
Dispersion of Gage Factor(%) |
≤±1 |
| Temp. Range(℃) |
-30～+80 |
STC Code |
9、11、16、23、27 |
| Strain Limit（％） |
2.0 |
Fatigue Life |
10000000 |
| Insulation Resistance(MΩ) |
10000 |
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3) BAB 250℃ Series
Imported Glass Fiber Reinforced Polyimide backing, BAB series offer excellent heat resistance, good insulation, thin
backing film, high stability and are suitable for both high precision stress analysis and accuracy transducers with
temperature up to 250℃.
Key Specifications:
| Backing Thickness(um) |
32±5 |
Sealing Layer Thickness(um) |
20±2 |
| Backing Material |
Glass Fiber Reinforced Polyimide |
Grid Material |
Karma Foil |
| Resistance(Ω) |
120，350，1000 |
Resistance Tolerance(%) |
≤±0.15 |
| Gage Factor |
1.86～1.98 |
Dispersion of Gage Factor(%) |
≤±1 |
| Temp. Range(℃） |
-269～+250 |
STC Code |
9，11，16，23，27 |
| STC Precision(um/m/℃) |
1.0 |
Insulation Resistance(MΩ) |
10000 |
| Strain Limit |
1.5％ |
Fatigue Life(±1000） |
10000000 |
2. Notes:
1) For BHB and BAM series strain gages, ZEMIC offers the High Performance Epoxy: H-600, H-610. They are accordance
with the function of the strain gages and can be applied as adhesive.
2) The recommended soldering temperature is 280℃, the maximum is 330℃. When soldering, it is better to control the
temperature as well as the soldering time since extra heat is harm for the strain gages, especially the insulation.
3) Be careful and cautious when using BHB, BAB series strain gages, in consideration of the fragility of the backing film.
4) The special requirements of the lead wires should be specified in the strain gages designation system.
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